Portfolio

Winner of an Innovation Award at the TechConnect World Innovation Conference and Expo for their Secure Wireless IoT Chipset for Smart Building and Smart City Applications. DEI Engineering designed and built the small demonstration Intelligent Sensing Board with: ASIC (Multiple Antenna Capacity, 5G equivalent, global, terrestrial and aerospace communications applications), BHI260AP - Self-learning AI smart sensor with integrated accelerometer and gyroscope, BMP390 - Digital pressure sensor, BMM150 - Geomagnetic sensor, BME688 - Digital low power gas, pressure, temperature & humidity sensor with AI, LTE 4G/5G, WiFi, and SD Card.

DEI worked with a major North American utility on a modular, turnkey power system that capitalizes on battery storage, power electronics and the lowering cost of renewables. DEI’s work included the design of control boards for Grid Synchronization, DC/AC Inverters, Solar Converter, Arc Fault Detection, Battery Management System, and Auxiliary Power. The designs include FPGA, ARM and DSP processors, high voltage signal conditioning and control circuits, data acquisition, and communications. DEI also consulted on the enclosure design.

DEI worked on an upgrade to the main control PCB for this system that actively grounds the shaft to the hull through a slip ring brush assembly. The system measures the shaft to hull potential through one slip ring assembly, and then uses this signal, after amplification, to control a high current power supply which draws a current out of the shaft through a second slip ring assembly and to virtually eliminate the extremely low frequency electromagnetic (ELFE) signature.

This mid volume product performs digital signal processing and signature analysis to offer in-depth insight into the performance, reliability, and repeatability for automotive production test applications. It is FPGA based and has dual channel 125 MSps inputs with 600 V isolation. It has full range of scope type feature and DSP processing options such a FIR filter.

This mid-volume bollard type family of products is used at automated bus routes stops or similar applications, to inform people by audible and visual signalling, and speech. The Annunciators are linked by wireless to a central controller. The product includes: STM32L476VET6 (ARM Cortex M4), 900 MHz wireless (Digi XBee SX 900 MHz RF module), GPS, BLE Beacon, microphone, speaker, voice codec, USB. DEI developed the hardware and firmware.

Developed this award-winning, low cost mid-volume handheld, battery powered device with e-paper display used by technicians in the air conditioning / refrigeration industry.

Reviewed the electrical and mechanical documentation package for accuracy and manufacturability, revised parts list / drawings, manufactured and tested a fully autonomous, high velocity drone based on Nvidia Jetson processor and using a Zoon LoRa module for telemetry.

Premier 7-Day or 5-2 Day programmable thermostat design. Cost reduction, new display, replacement micro, innovative minimal I/O design, ported code, prototyped, factor support for production test.

This next generation buried line sensor provides one-meter target detection for the most demanding sites in the world. DEI designed, prototyped, and supplied a drop-in replacement for an FPGA (Efinix Trion T85F324I4) Board due to FPGA supply problems. Component availability was a key requirement.

Developed two next generation DSP and FPGA based control boards for 400Hz and 28/270V GSE with high power active rectifiers, inverter control and buck converter controls. DEI responsibilities included specifications, hardware design, firmware development, and test fixtures.